Ansys 2025R1 is Released!
Ansys 2025 R1 release designed to empower engineering organizations with cutting-edge tools for rigorous digital design and real-world product delivery. At the heart of R1 are groundbreaking advancements in fundamental physics-based solutions, seamlessly integrated across engineering domains. Leveraging the power of Artificial Intelligence, our enhanced solvers and platform-level tools enable more efficient design exploration and deeper insights, transforming the way teams approach complex challenges.
Buttons below will lead you to ANSYS 2025 R1 updates session in different Ansys product families:
STRUCTURAL
Ansys 2025 R1 is our latest release designed to empower engineering organizations with cutting-edge tools for rigorous digital design and real-world product delivery. At the heart of R1 are groundbreaking advancements in fundamental physics-based solutions, seamlessly integrated across engineering domains. Leveraging the power of Artificial Intelligence, our enhanced solvers and platform-level tools enable more efficient design exploration and deeper insights, transforming the way teams approach complex challenges.
MATERIALS
Ansys Granta: Material Data at Your Fingertips: Anytime, Anywhere
Ansys Granta 2025 R1 introduces a wide range of new features and enhancements designed to create a unified experience for both Granta MI and Granta Integration users across CAD, CAE, and PLM platforms. This release includes significant improvements in user experience and introduces new material data in the areas of polymers, electromagnetics, and sustainability within the material libraries. From bringing forward new search capabilities to new adhesive and PCB data to a consistent experience for all users, Ansys Granta 2025 R1 helps engineers and designers to be more productive, without having to leave their preferred engineering tools.
A unified CAD, CAE, and PLM experience
The Granta Integrations with CAD, CAE, and PLM software, which connect Ansys Granta MI seamlessly with engineering tools, now feature a unified user experience between One MI and the integration interfaces. This new experience brings forward enhanced capabilities within the integration interfaces.
- Favorites management: Favorites can now be fully managed within CAD/CAE and PLM integrations based on the user’s role, providing flexibility and power, all without leaving the preferred engineering tool. Users can view the contents of their personal Favorites Lists and any published lists. They can also create, edit, delete, and request the publication of their own personal lists, as well as subscribe to or unsubscribe from published lists. Additionally, users can assign records directly to a Bill of Materials (BOM) or other lists.
- Search enhancements: Users now receive search suggestions when conducting a text search, enabling them to find what they’re looking for more quickly. Additionally, new faceted search capabilities allow users to easily adjust filters and receive live updates on their results. There’s also improved visualization and comparison of search results to facilitate better decision-making.
A superior user experience within Ansys Granta MI
New features in Ansys Granta MI enhance user experience, boost productivity, provide flexibility, and ensure solution completeness.
- Search: It is now possible to save searches in MI Explore as well as group search criteria and use the record tree as a criterion, boosting productivity by making finding information easier and more precise.
- User management: Users can now be filtered and managed by business unit and employee ID, providing more granular control for Ansys Granta MI administrators.
- Exporting record links: Static record links with record data including cross-database links can now be imported and exported.
More and better simulation-ready reference data
The Ansys Granta Material Data libraries have been enhanced with new records, all available within Ansys Granta MI and Ansys Granta Selector. Straightforward transfer/export of key material properties to other applications is available throughout.
- Polymers: The Polymers database has been updated with new data on polymers and adhesives from UL Prospector®, Kuraray, and 3M™, totaling over 109,000 records available for any use.
- Electromagnetics: More than 850 new printed circuit board and magnetic materials from leading providers such as Z-Zero, Neomaterials and Magnetics have been introduced for use in electromagnetic simulation in a broad frequency range.
- Sustainability: New and updated environmental impact data are now available for recycling, production, and processing.
ELECTRONICS
Ansys Electronics continues to demonstrate its leadership in computational electromagnetics, supporting cutting-edge product development across diverse markets and applications. The 2025 R1 is delivering enhanced simulation performance, meshing, pairing with other Ansys software products, and automated workflows capabilities to further solidify Ansys’ position in the multiphysics design and simulation of RF electronics, PCBs, assemblies, electric motors, and electronic devices. This includes leading applications in:
- Electric machines
- Consumer electronics devices
- Power electronics
- Chip-to-Systems & 3D-IC
- Wireless Communications, antennas & radars
The 2025 R1 includes the following key new product features and capabilities;
✓ New single design workflow for DC biased frequency domain analysis (Maxwell)
✓ New axial flux machine template (Motor-CAD)
✓ Higher accuracy with Continuum Air plus Skew Model for electric machines (Maxwell)
✓ Enhanced Mesh Fusion (HFSS & HFSS 3D Layout) and Multi-Node distribution (HFSS-IC)
✓ Complex Value Support for R/L in Edit Sources (Q3D)
✓ PI Advisor Enhancements (SIwave)
✓ Electronics AI+ (AEDT)
Ansys Maxwell
Ansys Maxwell for Consumer Electronic Devices: Widely used in motor design, Maxwell is increasingly being used by the world’s top consumer electronics companies. We continue to serve this market with the following new capabilities that will help users save time and expand the use of Maxwell in more applications:
- Enhanced frequency domain solver (A-Phi Eddy current) capability
- Single design workflow with DC Biased Frequency Domain Analysis
- Fields saving on selected objects: mesh/fields results files reduction
Ansys Motor-CAD
Ansys Motor-CAD & Ansys Maxwell for Electric Machines:
The added new capabilities further widen the competitive gap and allows for greater design flexibility of electric motors.
- New template for axial flux machines in Motor-CAD
- Improved workflows with the High Fidelity Efficiency maps in Motor-CAD
- Various solver enhancements in the EM, thermal and Lab modules of Motor-CAD
- Faster transient analyses (up to 10x) in Maxwell
- Higher accuracy with Skew model plus Continuum Air (2D) in Maxwell
- Unified performance map workflow in Maxwell with Motor-CAD and enhanced Motor-CAD model export to Maxwell
Ansys Icepak
Ansys Icepak for Thermal Integrity within the AEDT: The electronics cooling simulation software isadding the following new capabilities, including:
- Enhanced UX and workflows (TZR import speed up, and more!)
- Improved meshing, solving & physics
System-level thermal integrity solutions - Package on PCB workflow enhancements
- Ansys Mechanical in AEDT, thermal & structural enhancements
Ansys ConceptEV
Ansys ConceptEV for Electric Vehicle Powertrains: The cloud-based and collaborative design and simulation platform for EV powertrain promises to revolutionize the approach to powertrain development, empowering System and Components Engineering teams to create optimal solution. The main benefits/values are:
- Produce more efficient & competitive EV powertrain designs
- Accelerate time to market
- Boost innovation & team engagement
Achieve cost targets
Ansys HFSS
HFSS: Enhancing Precision for Complex Systems: HFSS receives critical updates to its mesh fusion capabilities, allowing users to set customizable component priorities for seamless intersection resolution. The 3D Component Array introduces multi-array support for antenna designs, enabling lattice contact, beam steering, and precise array definition. Additionally, HFSS SBR+ sees improvements in surface roughness modeling and near-field accuracy, which are vital for applications like radar cross-section analysis and Antenna-Antenna coupling.
HFSS-IC: Scalable Chip to Systems Solution: HFSS-IC integrates powerful solvers (HFSS, RaptorX™, andQ3D Extractor®) in an advanced “IC Mode” workflow, enabling efficient chip-level electromagnetic analysis. The introduction of automatic initial meshing optimizes geometry handling for faster setup. Beta supportfor DC IR analysis adds new capabilities, while distributed HPC for RaptorX accelerates large-scale simulations, empowering users with high-performance computing for IC design challenges.
Ansys SIwave
SIwave, Q3D Extractor, and Electronics Desktop: Holistic System-Level Upgrades: SIwave now features performance improvements for large impedance scans and transient excitation handling, significantly reducing simulation times. Q3D Extractor introduces beta support for radiated field computation and contact resistance modeling, advancing DC analysis. The Electronics Desktop leverages AI-driven predictive modeling and enhanced user workflows, offering faster interpolation for large 3D datasets and an intuitive experience for handling extensive designs.
3D DESIGN
Ansys Discovery 2025 R1 introduces powerful features enhancing the entire simulation workflow, enabling users to streamline model prep, increase simulation confidence, and accelerate design space exploration. New features focus on three main areas:
Accurate Thermal Management Simulation – Thermal management simulations, like electronics cooling and heat exchangers, are inherently complex and challenging to model efficiently. Discovery continues to enhance its capabilities to streamline and accelerate the entire simulation workflow, enabling more accurate simulation-driven design. Additionally, models can be seamlessly transferred to Ansys Icepak or Fluent for more detailed, in-depth simulations.
Efficient Model Preparation for Simulation – Discovery’s modeling capabilities continue to grow more powerful, enabling users to efficiently prepare and better understand their geometry. Each release introduces new and improved features to ensure a seamless transition from Ansys SpaceClaim.
Accelerated Parametric Workflows – With this release, Discovery is taking design exploration to new levels, allowing users to investigate moredesigns in less and less effort than ever before with new features like Burst to Cloud, PyAnsys, and automation through scripting.
FLUID
In Ansys 2025 R1, the Fluids product line continues to deliver critical enhancements to meet the performanceand productivity needs of our customers. The Fluent GPU Solver now supports additional physics, includingthe FGM combustion model, particle and droplet modeling with the discrete phase model (DPM), surface-to-surface radiation and more. The combination of these new capabilities provides a complete solution for GPU-based gas turbine combustion simulations.
The recently launched Fluent Web Interface now supports end-to-end workflows from meshing throughsolving to post-processing. Setup operations in the Fluent desktop GUI are 3-500X faster for cases with many zones, greatly reducing pre-processing times for complex assemblies. Finally, advancements across Thermal Desktop, Rocky and CFX include dramatic performance improvements, new multi-physics integrations, and additional optimization options.
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DYNA FORMING ENGINEERING & TECHNOLOGY
