ANSYS Electronics Webinar (Stress Analysis for QFP Lead)

Stress Analysis for QFP Lead | July 24, 2025

Ansys AEDT Mechanical enhances collaboration across engineering disciplines and accelerates product innovation by integrating key thermal analysis capabilities from Ansys Mechanical, its flagship solution for structural and thermal simulations, into the Electronics Desktop environment. With the Mechanical – Thermal solution, electrical and electronics engineers can import electromagnetic losses and seamlessly set up and analyze thermal models of their designs, executing all stages of a coupled workflow within a unified platform.

Upon completion of the webinar, participants will be able to:

• Design the QFP Lead using Ansys Modelling tools

• Simulate the Structural displacement for the QFP Lead

• Extract the equivalent stress for QFP Lead as it displace